Delivering high added-value solutions to our customers
Since pioneering the Force Sensing Resistor® (FSR) 35 years ago, Interlink Electronics has evolved into a leading provider of printed electronics, HMI devices, and sensor solutions. Today, we offer a full range of standard products as well as the ability to create custom solutions by leveraging our expertise in prototyping, materials science, firmware and software development, sensor fusion, system integration, and manufacturing.
We have developed sensor applications for numerous and diverse industries, such as the automotive, medical, industrial, and robotics fields. As a member of the LoRa Alliance ecosystem, Interlink is also active within the burgeoning Internet of Things (IoT) sector, adopting the essential role of a full-service system integrator for IoT applications. Strategic investments in recent years have allowed us to expand our R&D capabilities and focus on innovation and the creation of new IPs. We will further bolster our IP portfolio by seeking complimentary acquisitions in the near future.
We work closely with all of our customers to ensure on-time and on-budget solutions. Headquartered in Southern California, Interlink Electronics benefits from possessing a truly global footprint, with presences in China, Singapore, and Japan—allowing us to react quickly to customer needs while ensuring the highest quality standards.
Senior Management Team
At Interlink Electronics, a seasoned management team drives corporate strategy and directs the development of the world's most advanced and innovative force sensing technology. Learn more about the people who have propelled Interlink Electronics from a small startup to a global leader.
Steven N. Bronson
President & CEO
Mr. Steven N. Bronson has over 35 years of business and entrepreneurial experience. His successful background in investment banking, operations, and management has led him to acquire meaningful stakes in several promising technology companies and assuming CEO roles.
Mr. Bronson became the CEO and Chairman of Interlink Electronics in July of 2010. In March of 2011, he also took on the role of President, bringing both his operational and financial expertise to the company. Since successfully returning Interlink's business to profitability, Mr. Bronson has focused on strategic matters, mission-critical decisions, and the identification of potential acquisitions and business partnership opportunities.
In July 2013, Mr. Bronson assumed the positions of President and CEO of Qualstar Corporation—a high-quality tape library manufacturer—and its subsidiary N2Power, a manufacturer of high efficiency power supplies for diverse electronics industries. He immediately initiated a turnaround strategy, implementing cost-cutting measures and aggressive sales efforts.
Mr. Bronson has held the position of CEO and Chairman of BKF Capital Group, Inc. (BKF), a publicly traded company operating through its wholly owned subsidiaries, BKF Investment Group, Inc. and BKF Asset Holdings, Inc. since October 2008.
In 1996, Mr. Bronson founded Bronson & Co. and served as CEO & Chairman until November 2014. Bronson & Co., LLC, is an investment banking firm that assists both private and public emerging growth and middle market companies with raising capital, mergers and acquisitions, and advisory services.
In addition, Mr. Bronson served on the board of Mikron Infrared Instruments, Inc. from September 1996 to July 2000. During a restructuring period spanning August 1998 to May 1999, he was appointed Mikron's Chairman and CEO. Mr. Bronson led the effort of recruiting a top-notch management team, eventually increasing the company's revenue by 500 percent; it was sold in April 2007.
Mr. Bronson currently holds the series 4, 7, 24, 53, 55, 63, 65, 66, and 79 licenses.
Ryan J. Hoffman
Chief Financial Officer
Ryan J Hoffman came to Interlink with more than two decades of auditing and professional experience accrued at two top global accounting firms. As CFO, he is a key member of Interlink’s executive team, managing financial strategy, overseeing all financial functions, structuring initiatives, and guiding corporate development. Along with helping to drive the company's ongoing search for new acquisition targets, he will also play a major role in collaborations and integrations. As the company continues to expand, his familiarity with managing multinational projects is vital as Interlink continues to expand its worldwide presence.
Before coming to Interlink, he spent 16 years at the accounting firm RSM and was a partner at the company for his last five years. There, he successfully led audits of global companies in industries that include technology, consumer products, and manufacturing. While there, he cultivated a specialization in software and multiple-element revenue recognition accounting and auditing. Prior to that, he worked for the Big Four accounting firm Ernst & Young.
Mr. Hoffman graduated with a degree in accounting from Chapman University and is a licensed CPA. He is also the CFO of Qualstar Corp and Qualstar's wholly owned subsidiary N2Power.
Vice President, Operations & Manufacturing
Declan Flannery has been a core member of the Interlink executive team for over 15 years. As Vice President of Operations and Manufacturing, his responsibilities include oversight over all facets of Interlinks global manufacturing operations. He has extensive experience managing and leading international manufacturing operations, primarily in China. With almost 30 years’ experience he has been instrumental in the growth of Interlink as a leader in the field of printed electronics. He also brings a strong quality focus with experience of international quality standards and ensuring Interlink remains the industry leader in terms of product quality and operational excellence.
Prior to joining Interlink his career progressed from manufacturing engineering to product development and then to senior manufacturing leadership roles in several technology companies in Ireland, the United Kingdom, and here in the United States. He brings broad and diverse experience in business development, sensor design and manufacturing, project management and product management to the executive team.
He holds four patents on force sensing technology and graduated from Manchester Metropolitan University with a Bachelor of Science in chemistry. He also holds a Diploma in Management from the Open University.
Gene Chen, Ph.D.
Vice President of Engineering & Advanced Materials
As Vice President of Engineering & Advanced Materials, Dr. Gene Chen heads up Interlink's R&D and materials science laboratory in Camarillo, Calif., and directs its global engineering team.
Chen arrived at Interlink with more than two decades of experience in electrical engineering and had managed teams and projects in a wide variety of fields, including force sensing technology. Prior to joining Interlink, he was CTO at force sensor company New Degree Technology, where he led its R&D and product development teams. His diverse, interdisciplinary background has also included roles managing projects working on nanomaterials and advanced materials for applications ranging from LEDs and OLEDs to semiconductors to dielectric coatings for spaceships. Chen has also served on numerous grant review panels for the NSF and Department of Energy.
Chen earned a doctorate of philosophy in electrical engineering—focusing on electro-physics and microelectronics—from the University of Maryland, College Park. An active member of the scientific community, he holds 14 patents, has published 17 scientific papers, and has sat on multiple peer review panels.